Handango Inc.

Intel Ultra Thin: CULV Arrandale Boosts Performance and Reduces Size

by Anand Lal Shimpi on Monday 24 May 2010

Intel launched their Core i3/i5 (Arrandale) mobile processors early in 2010, with roadmaps showing low voltage and ultra low voltage parts. Earlier today, Intel released new details on their CULV parts with a big emphasis on enabling thinner, ultra portable designs. We've been waiting for availability of CULV Arrandale parts ever since we heard about the parts, and finally the wait is over.

  • Digg
  • Facebook
  • Yahoo! Buzz
  • Twitter
  • Diigo
  • Propeller
  • StumbleUpon
  • Faves
  • Mixx
  • Tumblr

Syndicated via RSS From: http://www.anandtech.com

Get free white papers delivered direct to your inbox from IT Knowledge Hub! Register now for cutting edge webcasts, reports, and white papers in your area of expertise.

No Comments »

No comments yet.

RSS feed for comments on this post. TrackBack URI

Leave a comment

Copyright © 2010 IT Knowledge Hub LLC | Advertise | Contact | Privacy Policy | Terms of Use | Register